Volume-4,Issue-2

Title : The Role of Thermal Aging in Crack Growth of Lead-Free Solder Interconnects

Author : Samuel Ambosta, Anuraag Karnik, Pavan Rajmane, Dereje Agonafer.

USA

DOI:10.53414/UIJES:2024.402.6

Paper ID : UIJES:4201

Pages : (1-19)

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Title : An Exploration of execution and Influence of cloud computing in Supply Chain Stewards

Author : Narmadha Eluri,

Asst’ Professor of CSE, Bapatla Women’s Engineering College, Bapatla.

DOI:10.53414/UIJES:2024.402.25

Paper ID : UIJES:4202

Pages : (20-25)

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Title : Lifecycle Management of Large Language Models in Financial Systems: Monitoring, Drift Detection, and Governance

Author : Gopichand Talluri,

Overland Park, Kansas, USA, 66213.
Gopichand.bigdtech@gmail.com

DOI:10.53414/UIJES:2024.402.38

Paper ID : UIJES:4203

Pages : (26-38)

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